Insights from Our Partners

The partnership between City University of Hong Kong (CityUHK) and Hon Hai Research Institute (HHRI) began in 2021. Together, both sides not only advanced the real-world application of academic research but also provided authentic testing environments, accelerating talent development and resource integration.

Compound semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) are known for their high efficiency, high breakdown voltage, and ability to withstand extreme temperatures. These materials form the foundation of high-power, energy-efficient technologies that drive electric vehicles, 5G communications, and fast-charging systems. To bridge academia's deep expertise in GaN-based semiconductors with applications and manufacturing resources within the industry, the Hon Hai Research Institute began collaborating in mid-2022 with Associate Professor Tian-Li Wu and his team from the Institute of Electronics at National Yang Ming Chiao Tung University (NYCU).

The Industry Academia Innovation School (IAIS) at National Yang Ming Chiao Tung University (NYCU) has collaborated with the Next-generation Communications Research Center since 2021. Professor Kai-Ten Feng, Professor and Chair of the Department of Electronics and Electrical Engineering at NYCU, explains that the university established the IAIS with government support to cultivate semiconductor industry talent and promote co-creation between academia and industry. In pursuit of suitable industry partners, IAIS found an ideal match in the Next-generation Communication Research Center.

“While Taiwan has advantages in semiconductors and communications, it entered the field of quantum computing relatively late. To make up for this gap, we must seek external partners,” explains Dr. Min-Hsiu Hsieh, Director of the Quantum Computing Research Center, as he outlines his motivation for building a global partner ecosystem.

To address AI-related security challenges in electric autonomous vehicles, Associate Professor Chia-Mu Yu from NYCU's Department of Electronics and Electrical Engineering has partnered with HHRI to examine how adversarial stickers and surface dirt can cause vehicle cameras to misjudge road conditions. As collaboration deepened and given Hon Hai Technology Group's leadership in manufacturing, the research focus gradually shifted toward AI security in smart manufacturing. The goal is to ensure that highly automated production lines and lights-out factories possess the resilience needed to withstand cybersecurity attacks.